Definition

VIPPO (Via-In-Pad Plated Over) places vias directly in component pads, fills them with conductive or non-conductive material, and plates over flat. Essential for fine-pitch BGAs where escape routing requires vias in the pad pattern. Without filling/plating, solder wicks into vias causing insufficient joints. Process: drill via, plate, fill (copper or epoxy), planarize, plate over. Adds cost ($50-200 per panel) but enables dense designs impossible otherwise. Alternative: via-in-pad with capped (non-planar) surface works for some applications at lower cost.