Definition

Plating deposits metal onto PCB surfaces through electrochemical processes. Electroless plating provides initial conductivity on non-conductive surfaces (drilled hole walls); electroplating builds up copper thickness. Standard plating adds 20-25µm copper to hole walls for reliable interconnection. Thicker plating (35-50µm) improves reliability for thermal cycling. Over-plating causes problems - reduced hole diameter, uneven surfaces. Pattern plating vs panel plating affects final copper thickness and distribution. Plating quality directly affects via reliability and is verified through microsection analysis.