Definition

A pad is a copper area designed for component attachment (SMT or through-hole) or via termination. SMT pads match component footprints with size optimized for solder joint reliability. Through-hole pads include an annular ring around the drill hole. Pad size affects soldering: too small causes insufficient joints, too large wastes space and can cause bridging. Pad shape can be round, square, oblong, or custom. Thermal relief connects pads to planes while maintaining solderability. Pad-to-pad clearance must meet design rules. Non-plated pads serve as test points or mounting features.