Definition

IPC-2226 establishes design requirements for high-density interconnect boards featuring microvias, fine lines, and compact layouts. It provides guidelines for microvia formation (laser drilling parameters), metallization requirements, signal/power/ground layer distribution, and dielectric separation. Required reading when designs use fine-pitch BGAs (below 0.5mm pitch) or microvia technology. The standard helps you design HDI structures that can actually be manufactured reliably.