Shipco Logo
PCB Glossary

PCB Glossary

Conflict Minerals

Standards & Certifications

Regulations requiring disclosure of tin, tantalum, tungsten, and gold (3TG) sourcing from conflict regions.

Definition

Conflict minerals regulations (Dodd-Frank Act Section 1502 and EU 2017/821) require companies to disclose use of 3TG minerals (tin, tantalum, tungsten, gold) from conflict-affected regions. Tin is used in solder and surface finishes, tantalum in capacitors, tungsten in some components, and gold in ENIG finishes and wire bonding. Your customers may require Conflict Minerals Reporting Templates (CMRTs) from your supply chain. Large OEMs typically have conflict minerals compliance programs you'll need to participate in.

Need help with your PCB project?

Our engineers can help you navigate the complexities of PCB design and manufacturing. Get expert guidance on materials, stackups, and manufacturing processes.

Get a Quote