Definition

Ceramic substrates (alumina Al₂O₃, aluminum nitride AlN, LTCC) offer properties unmatched by organic laminates: excellent thermal conductivity (AlN: 170-230 W/mK vs FR-4's 0.3), stable Dk across temperature/frequency, zero moisture absorption, and high-temperature capability. Used for RF/microwave modules, power electronics, and LED packages. Processing differs from PCB - thick/thin film metallization, screen printing, co-fired construction. Cost is 10-100x organic PCBs. Ceramic-filled PTFE (Rogers) provides some ceramic benefits in conventional PCB processing.